Yield and quality control

Which concept expresses, from particle size and wiring layout, the area in which a falling particle could cause a failure?

  1. AActive area
  2. BDie area
  3. CCritical area
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Answer: C. Critical area

Critical area is the area of positions where a particle of a given size would cause a short or open in the wiring. It becomes larger the denser the wiring and the larger the particle. Critical area and defect density are used to predict yield and improve layouts.

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More Yield and quality control questions

  1. Which technique digs into a problem by repeatedly asking 'why' to find its true cause?
  2. A wafer has 600 chips and the yield is 80%. How many good chips are there?
  3. If wafer process yield is 95% and wafer test yield is 90%, approximately what is the overall yield obtained by multiplying them?
  4. What is the system called that tracks each product's manufacturing history, needed to identify products that may have been affected when an abnormality is found?
  5. Which technique rejects chips that are within specification in test but show values far outside the distribution of the same lot?