Yield and quality control

What is the purpose of inspecting for defects after each step and extracting only the defects newly added since the previous step?

  1. ATo identify in which step (equipment) the defects occurred
  2. BTo set chip prices
  3. CTo make wafer colors uniform
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Answer: A. To identify in which step (equipment) the defects occurred

Comparing defect inspection results step by step and subtracting defects found in the previous inspection reveals defects newly generated in the intervening steps. This allows the step or equipment generating defects to be identified and addressed.

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More Yield and quality control questions

  1. Which concept expresses, from particle size and wiring layout, the area in which a falling particle could cause a failure?
  2. Which technique digs into a problem by repeatedly asking 'why' to find its true cause?
  3. A wafer has 600 chips and the yield is 80%. How many good chips are there?
  4. If wafer process yield is 95% and wafer test yield is 90%, approximately what is the overall yield obtained by multiplying them?
  5. What is the system called that tracks each product's manufacturing history, needed to identify products that may have been affected when an abnormality is found?