Testing and inspection

What is the main purpose of testing in semiconductor manufacturing?

  1. ATo find and remove defective parts made during manufacturing and ship only products that meet specifications
  2. BTo check the color of the chips
  3. CTo weigh the chips
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Answer: A. To find and remove defective parts made during manufacturing and ship only products that meet specifications

However well controlled, manufacturing produces a certain fraction of chips with defects. Testing checks electrical characteristics and functions and removes defective parts so only products that meet specifications are shipped. Test results are also used to improve the manufacturing process.

  • A. Correct. Defective parts are removed so only good ones ship.
  • B. Checking color is not the purpose.
  • C. Weighing chips is not the purpose.
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More Testing and inspection questions

  1. In wafer testing, where on the chip do the probe card needles make contact?
  2. What is the basic method for judging whether a chip is good in logic circuit testing?
  3. In testing, what is the set of sequences of 0 and 1 signals applied to a chip's inputs, together with the expected responses, called?
  4. What are the dedicated patterns called, placed between chips on the wafer (in scribe lines) and elsewhere, used to measure characteristics of transistors, resistors and the like to evaluate the process?
  5. What is the inspection called that measures TEG parameters such as threshold voltage and sheet resistance on wafers that have completed front-end processing, to confirm the process met specifications?