Lithography

Which metric describes nanometer-scale roughness on the sidewalls of fine resist patterns?

  1. ADepth of focus (DOF)
  2. BNumerical aperture (NA)
  3. CLine edge roughness (LER)
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Answer: C. Line edge roughness (LER)

LER indicates the size of the roughness along pattern edges. As patterns become finer, even a few nm of roughness can no longer be ignored as line-width variation and causes variation in transistor characteristics. Stochastic fluctuations in resist materials and exposure dose are among its causes.

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More Lithography questions

  1. Which correctly describes the factor k1 in the resolution formula R = k1 × λ / NA?
  2. What is the main cause of the stochastic fluctuations that are a problem in EUV lithography?
  3. Why are defects buried inside the multilayer of an EUV mask a problem?
  4. What is the range of exposure dose and focus over which pattern dimensions stay within tolerance called?
  5. In LELE (litho-etch-litho-etch) double patterning, what is especially strictly required?