Etching

In plasma etching of high-aspect-ratio patterns, which phenomenon has electrons blocked by sidewalls so negative charge builds at the top of the pattern while positive ions are deflected at the bottom, causing profile defects and damage?

  1. AThe electron shading effect
  2. BThe tunnel effect
  3. CThe piezoelectric effect
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Answer: A. The electron shading effect

Electrons move in random directions and have trouble entering deep into narrow patterns, so negative charge builds on the upper sidewalls. Ions arrive vertically and charge the bottom positively. This charge imbalance deflects subsequent ions, causing notching and gate insulator damage.

  • A. Correct. Electrons are shaded, creating a charge imbalance.
  • B. The tunnel effect is a quantum phenomenon of passing through a barrier.
  • C. The piezoelectric effect relates force and charge in piezoelectric materials.
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More Etching questions

  1. Which research-stage etching method neutralizes plasma-generated ions before they hit the wafer, suppressing charging and UV damage?
  2. Why are coatings such as yttrium oxide (Y2O3) used on the inner walls and parts of plasma etch tools?
  3. In plasma etch tools, what is the main role of the focus ring surrounding the wafer edge?
  4. Which correctly describes anisotropic etching?
  5. Which correctly describes 'selectivity' in etching?