Static vs Dynamic Power in CMOS: Key Differences
Power in CMOS circuits divides into dynamic power, used when signals switch, and static power, used continuously even without switching. Dynamic power comes from charging and discharging wire and gate capacitance and is expressed as P = αCV²f. Static power comes from leakage current through off transistors and other paths, and it rises sharply as temperature goes up. As scaling lowered supply voltage and threshold voltage, static power grew to a larger share.
| Aspect | Static power | Dynamic power |
|---|---|---|
| Also called | Leakage power | Switching power |
| Cause | Subthreshold leakage of off transistors, gate leakage, junction leakage, etc. | Charging and discharging of load capacitance. Sometimes includes short-circuit current when pMOS and nMOS are on at the same time during switching |
| Rough equation | P = V × Ileak (Ileak: leakage current) | P = αCV²f (α: activity factor, C: capacitance, V: supply voltage, f: frequency) |
| When the circuit is idle | Consumed as long as power is on | Almost zero if signals do not switch |
| Dependence on supply voltage | Increases faster than proportionally to voltage, because leakage current itself also increases due to DIBL and other effects | Proportional to the square of the voltage |
| Dependence on frequency | Almost none | Proportional to frequency |
| Dependence on temperature | Strong. Increases exponentially with temperature and can also cause thermal runaway | Weak |
| Dependence on threshold voltage | Strong. Lowering the threshold increases subthreshold leakage exponentially (roughly 10 times for every 60 to 100 mV decrease at room temperature) | No direct dependence. However, a high threshold makes the circuit slower |
| Reduction techniques | Power gating, high-threshold transistors (multi-Vt), lowering voltage in standby, suppressing gate leakage with high-k/metal gates | Clock gating, DVFS, lowering supply voltage, reducing capacitance, reducing activity factor |
| Change with scaling | Rose sharply because threshold voltage was lowered along with supply voltage, becoming a non-negligible share. Structures with better gate control such as FinFETs keep it in check | Under Dennard scaling, shrinking dimensions and voltage by the same ratio kept power density constant. As voltage became hard to lower, rising power density became a problem |
| When it matters | Devices that spend long periods in standby, chips that run at high temperature | When running actively at high frequency |
Figures are typical orders of magnitude and vary by process generation and product.