Yield and quality control

Among the causes of yield loss, what are defects called that recur in specific patterns due to, for example, interactions between design and manufacturing processes?

  1. ASystematic defects
  2. BRandom defects
  3. CSoft errors
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Answer: A. Systematic defects

Causes of yield loss are divided into random defects, which occur probabilistically from particles and the like, and systematic defects, which occur reproducibly with specific layouts or process conditions. As scaling advances, DFM (design for manufacturability), which prevents systematic defects at the design stage, becomes important.

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More Yield and quality control questions

  1. Which diagram organizes the relationship between a problem (effect) and the factors that influence it in a shape like a fish skeleton?
  2. What is the main purpose of analyzing wafer maps, which show wafer test results as pass/fail for each chip position on the wafer?
  3. With all else equal, about how many times larger does wafer area become when wafer diameter is increased from 200 mm to 300 mm?
  4. In a control chart, which is an example that should be judged abnormal even though all points are within the control limits?
  5. In the Poisson model Y = exp(−D × A), with defect density D = 0.1 /cm² and chip area A = 1 cm², approximately what is the yield?