Reliability

Which phenomenon creates voids as metal atoms move due to internal stress in wiring, even without current flowing?

  1. AElectromigration
  2. BStress migration
  3. CLatch-up
Show answer and explanation

Answer: B. Stress migration

Because wiring and the surrounding insulator have different coefficients of thermal expansion, tensile stress remains inside the wiring after heat treatments during manufacturing. Stress migration is the phenomenon in which metal atoms move to relieve this stress, forming voids. Its cause differs from that of current-driven electromigration.

Practice this topic Back to topic

More Reliability questions

  1. What is the phenomenon called in which needle-like metal crystals grow from the surface of tin plating and short to an adjacent terminal?
  2. Which typical reliability test evaluates lifetime and failure rate by operating products at high temperature for a long time?
  3. For a failure mechanism with an activation energy of 0.7 eV, approximately what is the Arrhenius acceleration factor of 125 °C relative to 55 °C? (Boltzmann constant 8.6×10⁻⁵ eV/K)
  4. Which correctly describes the general approach to failure analysis?
  5. What is the common name for the phenomenon in which, at gold wire to aluminum pad bonds, intermetallic compounds and voids grow during long storage at high temperature, weakening the bond?