Lithography

Which correctly describes writing patterns directly into resist on the wafer with an electron beam, without a mask?

  1. AIt is the fastest method for volume production
  2. BIt needs no mask and can write very fine patterns, but writing takes so long that it is unsuited to mass production
  3. CIt cannot write patterns
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Answer: B. It needs no mask and can write very fine patterns, but writing takes so long that it is unsuited to mass production

Electron-beam direct writing scans the beam to draw patterns one by one, so very fine patterns can be formed without a mask. But writing takes a long time, so it is unsuited to mass production and is used for research and development, small-volume prototypes, photomask making and similar.

  • A. Because it draws patterns serially, it is slow for volume production.
  • B. Correct. No mask is needed, but writing takes time.
  • C. It can write patterns.
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More Lithography questions

  1. How is 13.5 nm light generated in the light source of an EUV lithography tool?
  2. What is the process called that removes, with solvent, the resist that builds up around the wafer edge after spin coating?
  3. In current scanner exposure tools, what is the typical maximum area on the wafer that can be exposed in one exposure (one shot)?
  4. Which technique uses computation to jointly optimize the illumination shape of the exposure tool and the mask pattern to improve resolution?
  5. In immersion lithography with very high numerical aperture (NA), why does light polarization need to be considered?