Semiconductor industry and market
Which correctly distinguishes the 'front end' and 'back end' of semiconductor manufacturing?
- AThe front end is design, and the back end is manufacturing
- BThe front end builds circuits on the wafer, and the back end cuts out chips and assembles and tests them
- CThe front end is testing, and the back end is wafer manufacturing
Show answer and explanation
Answer: B. The front end builds circuits on the wafer, and the back end cuts out chips and assembles and tests them
The front end builds circuits on wafers by repeating steps such as deposition, lithography, etching and ion implantation. The back end assembles chips cut from the wafer into packages, tests them and ships them. With advanced packaging growing in importance, the boundary between the two is becoming blurred.