CMP and cleaning

Which cleaning method, researched and commercialized for removing particles without collapsing fine patterns, sprays tiny particles of cryogenic carbon dioxide or argon?

  1. ASPM cleaning
  2. BBrush scrub cleaning
  3. CCryogenic aerosol cleaning
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Answer: C. Cryogenic aerosol cleaning

Cryogenic aerosol cleaning sprays tiny solid particles formed by expanding chilled argon or carbon dioxide onto the wafer, knocking particles away by impact. Because no liquid is used, there is no pattern collapse during drying and no chemical damage, making it suitable for cleaning fine structures.

  • A. SPM cleaning removes organics with a mixture of sulfuric acid and hydrogen peroxide.
  • B. Brush scrubbing rubs physically and tends to damage fine patterns.
  • C. Correct. It is a dry cleaning method that sprays cryogenic particles.
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More CMP and cleaning questions

  1. What is the main purpose of a CMP head that can vary the pressure pressing the wafer in several concentric zones?
  2. Which CMP method fixes the abrasive particles in the polishing pad instead of putting them in the slurry?
  3. Which known problem tends to occur if rinsing after SPM (sulfuric acid and hydrogen peroxide) cleaning is insufficient?
  4. Which polishing method, studied for uses that require low mechanical force, combines electrochemical dissolution to planarize metal?
  5. Which correctly describes CMP (chemical mechanical polishing)?