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Automotive Semiconductors and Functional Safety

For an automotive semiconductor, which is the correct way to proceed when you want to change the manufacturing fab or the materials used?

  1. AIf internal checks confirm the electrical characteristics are within the datasheet specifications, the change can be made without informing the customer
  2. BNotify the customer in advance of the change and its impact via a PCN (Product Change Notification), present requalification results as needed, and obtain agreement
  3. CThe customer only needs to be informed if a problem occurs in the field after the change
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Answer: B. Notify the customer in advance of the change and its impact via a PCN (Product Change Notification), present requalification results as needed, and obtain agreement

Automotive components are premised on being made with the approved design, process and fab. Changing the fab, materials, process or package can alter reliability or subtle characteristics even if values stay within the datasheet. Therefore, the change and its impact are notified in advance via a PCN (Product Change Notification), the necessary reliability tests are repeated, and the switch is made after obtaining the customer's agreement. AEC-Q100 also gives guidelines on which tests to repeat for each type of change.

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More Automotive Semiconductors and Functional Safety questions

  1. What is the main purpose of recording the lot number, wafer number and on-wafer coordinates during wafer test in electrically programmable non-volatile memory (such as fuses) inside an automotive IC?
  2. In qualification of automotive ICs, what is the main reason HAST (a biased test in pressurized water vapor at around 130 °C and 85% RH) is sometimes used instead of the temperature humidity bias test (THB) run at 85 °C and 85% RH for 1000 hours?
  3. Why are latch-up tests on automotive ICs required not only at room temperature but also at the product's maximum operating temperature?
  4. Which correctly describes the difference between component-level ESD tests of ICs (HBM and CDM) and system-level ESD tests performed on finished automotive equipment?
  5. Which correctly describes the functional safety standard ISO 26262?