Image sensors and optical devices

Which correctly describes a stacked CMOS image sensor?

  1. AA structure with many lenses stacked
  2. BA structure that does not use photodiodes
  3. CA structure in which the pixel section and the signal-processing circuits are made on separate chips and bonded together
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Answer: C. A structure in which the pixel section and the signal-processing circuits are made on separate chips and bonded together

In a stacked sensor, the pixel chip and the logic chip that performs AD conversion and image processing are each made with optimal processes and then bonded together. This allows high-speed readout and more features while keeping chip area small, and it is widely used in smartphone cameras.

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  1. What problem tends to occur when the pixel size of an image sensor is reduced?
  2. What is the measurement principle of a ToF (time-of-flight) sensor?
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  5. Which is a correct technique for HDR (high dynamic range) in image sensors, for scenes containing both bright and dark areas?