CMP and cleaning

What is the main purpose of cleaning with ozone dissolved in ultrapure water (ozonated water)?

  1. ATo deposit metal films
  2. BTo polish the wafer
  3. CTo oxidize, decompose and remove organics
Show answer and explanation

Answer: C. To oxidize, decompose and remove organics

Ozonated water has strong oxidizing power and is used to remove organics and oxidize the silicon surface. Compared with cleaning using sulfuric acid and other chemicals, it reduces chemical use and waste, making it a lower-environmental-impact cleaning method.

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More CMP and cleaning questions

  1. What is the role of benzotriazole (BTA) and similar additives in copper CMP slurries?
  2. What is the role of the retaining ring that surrounds the wafer in a CMP polishing head?
  3. Why are particles, once detached, unlikely to redeposit in alkaline cleaning solutions such as SC-1?
  4. What problems are caused by metal contamination such as iron and copper on the wafer surface?
  5. What is the main cause of fine scratches on the wafer surface in CMP?