English
Menu

Automotive Semiconductors and Functional Safety

Which correctly pairs AEC-Q100, AEC-Q101 and AEC-Q200, the qualification standards for automotive electronic components, with the components they mainly cover?

  1. AQ100: integrated circuits (ICs); Q101: discrete semiconductors such as diodes and transistors; Q200: passive components such as resistors and capacitors
  2. BQ100: passive components; Q101: integrated circuits (ICs); Q200: discrete semiconductors such as diodes and transistors
  3. CQ100: discrete semiconductors; Q101: passive components; Q200: integrated circuits (ICs)
Show answer and explanation

Answer: A. Q100: integrated circuits (ICs); Q101: discrete semiconductors such as diodes and transistors; Q200: passive components such as resistors and capacitors

The AEC standards are divided by component type. Integrated circuits such as microcontrollers and power ICs fall under AEC-Q100; discrete semiconductors such as diodes, power MOSFETs and IGBTs fall under AEC-Q101; and passive components such as resistors, capacitors, inductors and crystal resonators fall under AEC-Q200. Because the components differ in structure and failure behavior, the test items and conditions also differ. For example, automotive multilayer ceramic capacitors use AEC-Q200-compliant types.

Practice this topic Back to topic

Books on Automotive Semiconductors and Functional Safety Ad

As an Amazon Associate I earn from qualifying purchases.

More Automotive Semiconductors and Functional Safety questions

  1. Assume an automotive component operates continuously 24 hours a day for 15 years. Approximately how many hours is its total operating time?
  2. Which best describes the "zero defect" philosophy required for automotive semiconductors?
  3. Which correctly describes PPAP (Production Part Approval Process) used in the automotive industry?
  4. For an automotive semiconductor, which is the correct way to proceed when you want to change the manufacturing fab or the materials used?
  5. What is the main purpose of recording the lot number, wafer number and on-wafer coordinates during wafer test in electrically programmable non-volatile memory (such as fuses) inside an automotive IC?