Reliability

Which model expresses the fatigue life of solder joints under temperature cycling as a relationship between the temperature swing (strain magnitude) and the number of cycles?

  1. AThe Coffin-Manson relationship
  2. BBlack's equation
  3. CMoore's law
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Answer: A. The Coffin-Manson relationship

The Coffin-Manson relationship links the magnitude of repeated strain to the number of cycles to fatigue failure; larger temperature swings mean fewer cycles to failure. It is used to estimate lifetime in real environments from temperature cycling test results.

  • A. Correct. It relates temperature swing to fatigue life.
  • B. Black's equation is the electromigration lifetime equation.
  • C. Moore's law is an empirical rule about integration density.
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More Reliability questions

  1. Which statistical distribution is commonly used to describe the times to failure of many wires in electromigration life tests?
  2. In automotive and similar applications, what is the summary called of which temperature, voltage and operating-time conditions a product will be exposed to over its lifetime?
  3. If 10,000 parts with a failure rate of 100 FIT are used for one year (about 8,760 hours), which is closest to the expected number of failures? (1 FIT = 1 failure per 10⁹ hours)
  4. On printed circuit boards and similar, what is the phenomenon called in which, under humid conditions, metal (such as silver or copper) dissolves as ions between biased electrodes, migrates and deposits in tree-like forms, causing a short?
  5. In high-k/metal gate nMOS transistors, what is the degradation called in which the threshold voltage shifts when positive gate voltage and high temperature are applied continuously?